Multi-Chip Module

MCM has the same basic construction as Chip-On-Board but with some significant differences. Adding multiple integrated circuits allow us to combine more circuit functions into one multichip module.

MCM has the same basic construction as COB but with some significant differences. Adding multiple integrated circuits allow us to combine more circuit functions into one multichip module, which further reduces circuit size and mass.

Ceramic substrate construction also provides superior thermal heat dissipation capability in harsh environments, making MCM an excellent choice for many industrial applications.

The MCM footprint is much smaller than conventional single chip packages. The smaller motherboard, and potentially smaller space requirements for panels, enclosures, and cabling result in a high-density module that resembles a single component when mounted on your printed circuit board.

ISSI Capabilities:

  • Compact packaging design
  • High level of thermal protection and heat dissipation
  • Circuit sealing using a variety of lids or conventional coating materials
  • Alumina (AL2O3), Aluminum Nitride (AIN), Beryllia (BeO) substrate materials
  • Electrical and environmental testing available
  • Improved signal-to-noise ratio
  • Multi-layer substrates
  • Package layout and design capabilities
  • Assembled, tested, and inspected to MIL-STD and IPC specifications
  • Full turnkey assemblies available

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