Design and Analysis

Our engineering department measures their successes one project at a time. Active participation with every customer ensures their objectives are achieved in an efficient and cost effective manner.


The Engineering Department has extensive experience in layout design of complex circuit assemblies like those found in multi layered thick film hybrids, COB (Chip-on-Board), and MCM (Multi-chip-Module). We also offer these services for surface mount and through hole printed circuit board assemblies. We have been engineering quality into the circuits we design and manufacture for over 35 years.


The paramount goal of our engineering department is to meet and exceed the goals of the customer and improve the quality of the circuit assembly. Customers can choose from a variety of services to enhance the project cost effectiveness and reliability of the circuit assembly. Some of the services that we offer include:

  • Schematic Analysis
  • Bill of material review
  • Layout and packaging technology review
    • Surface Mount
    • Through-hole
    • Thick film Hybrid
    • COB (Chip on Board)
    • MCM (Multi chip Module)
  • Design for manufacturability review
  • Design layout of electrical circuit
  • Electrical and environmental test procedure design and implementation
  • Trouble shooting analysis
  • Cost reduction analysis